Fabrication of Embedded Micro Electronic Circuit Structures using Laser Direct-Write Techniques

Saritha P

doi:10.36948/ijfmr.2025.v07i06.39274

Fabrication of Embedded Micro Electronic Circuit Structures using Laser Direct-Write Techniques

Author(s)	Dr. Ms. Saritha P
Country	India
Abstract	ABSTRACT The endless demand for new and improved consumer products such as cell phones, digital cameras and PDA’s relentlessly pushes for higher functionality in increasingly smaller packages. The development of embedded surface mount devices, IC’s, interconnects and power source elements offers the ability to achieve levels of miniaturization beyond the capabilities of current manufacturing techniques. By burying or embedding the whole circuit under the surface, significant reduction in weight and volume can be achieved for a given circuit board design. In addition, embedded structures allow for improved electrical performance and enhanced function integration within traditional circuit board substrates. Laser-based direct-write (LDW) techniques offer an alternative for the fabrication of such embedded structures at a fraction of the cost and in less time that it would take to develop system on-chip designs such as ASIC’s. Laser micromachining has been used in the past to machine vias and trenches on circuit board substrates with great precision, while laser forward transfer has been used to deposit patterns and multi layers of various electronic materials. Laser direct-write processing techniques are being applied for rapid prototyping and to specific 3D fabrication steps where conventional microelectronics fabrication techniques fall short. In particular, a laser based technique has been developed that combines the rapid prototyping aspects of direct-write and the low cost/process uniformity aspects of batch processing. The goal of this work is to demonstrate the use of laser direct-write processes to carry out the various steps required to fabricate a complete embedded circuit in a plastic substrate requiring low processing temperatures (< =100o C)
Keywords	Keywords: Laser Direct-Write, Laser Micromachining, Embedded Passives, Embedded Bare-die.
Field	Physics > Electric
Published In	Volume 7, Issue 6, November-December 2025
Published On	2025-12-05
DOI	https://doi.org/10.36948/ijfmr.2025.v07i06.39274

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Fabrication of Embedded Micro Electronic Circuit Structures using Laser Direct-Write Techniques

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